The Recycled Materials Association (ReMA) today announced its initial speakers for the inaugural virtual event, The ReMA Future of Fiber Forum, as it invites applications from packaging and recycling professionals to join the forum early next year.
The speakers for the half-day event will include:
- Robin K. Wiener, President, ReMA
- Kathy Delano, Brokerage Sales, Dixie Pulp and Paper
- Daniel J. Domonoske, Executive VP, Potential Industries
- John Dunlap, Area General Manager of Southwest and Midsouth Regions, Pratt Industries
- Robb Espinosa, Sr VP of Operations, Circular Services
- Scott Huffer, Principal Engineer, TOPPAN Packaging Americas
- Bill Moore, President, Moore & Associates
- Leonard Zeid, President, Brokerage Division, Midland Davis
Additional speakers will be added to the agenda in the coming weeks.
The ReMA Future of Fiber Forum, a virtual only event, created to join the paper packaging and fiber recovery industries, will take place from 1:00 PM to 4:00 PM Eastern Standard Time on Tuesday, January 27, 2026, and will be hosted by the Recycled Materials Association (ReMA). The event will include remarks, discussions, and Q&A sessions to promote understanding of fiber recovery market trends, developments in packaging, inform changes to ReMA’s Fiber Recycling Readiness Tool, and more.
“The fiber recovery and paper packaging industries are undergoing rapid and significant transformation,” said ReMA President Robin Wiener. “The Future of Fiber Forum will bring together the leaders from across this space to create greater understanding and dialogue of the unique needs of all contributors. We will also seek feedback on how to continue to evolve and improve ReMA’s Fiber Recycling Readiness Tool to support the work of product and packaging engineers and designers.”
ReMA’s Fiber Recycling Readiness Tool is a resource that assists engineers and designers to understand fiber packaging’s compatibility with the current U.S. residential recycling system.
Applications for this forum are due this Friday, November 7, 2025, space is limited. Those interested can apply via this link.