Sustainability without extra effort: With Technomelt Supra 130 Cool, customers benefit from trusted bonding performance and a reduced carbon footprint. (Photo: Henkel)
Henkel Adhesive Technologies is demonstrating how measurable sustainability can go hand in hand with trusted performance and food safety by optimizing its hot melt adhesive Technomelt Supra 130 Cool. The proven adhesive is now produced with a minimum 20% reduction in carbon emissions, measured across the entire cradle-to-gate segment of the value chain. For customers, this means same bonding performance, full supply continuity – and a more sustainable product delivered automatically.
The chemical formulation of the adhesive, widely used for carton, tray, and folding box applications in both food and non-food sectors, remains unchanged. The CO₂ reduction is achieved through strategic supplier partnerships that replace fossil fuels with renewable resources and integrate more energy-efficient technologies into existing production processes. Henkel uses these low-emission raw materials at all relevant production sites across Europe, ensuring that every customer using Technomelt Supra 130 Cool benefits from an improved sustainability profile.
“Same bond. Smaller footprint.” – With this principle, Henkel actively supports its customers in achieving their sustainability goals. Companies can improve their carbon footprint without any changes to application or logistics. “A reduction in CO₂e emissions across our supply chains is a key step toward lower-emission industrial adhesives,” says Kathrin Hein, Vice President Consumer Goods EIMEA at Henkel. “We’re setting new standards for a more sustainable packaging industry and enabling our customers to meet their sustainability targets.” Henkel plans to launch additional optimized products from its existing portfolio next year.
For more information about Technomelt Supra 130 Cool, other hot melt adhesives for sustainable packaging, and Henkel’s holistic approach to packaging adhesives, visit us at Fachpack 2025, Hall 1, Booth 153, from September 23 to 25.